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Electrical sintering of nanoparticle structures

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Mark L Allen, Mikko Aronniemi, Tomi Mattila, Ari Alastalo, Kimmo Ojanperä, Mika Suhonen and Heikki Seppä

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A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.


PACS

81.20.Ev Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation

73.63.Bd Nanocrystalline materials

61.46.Df Structure of nanocrystals and nanoparticles ("colloidal" quantum dots but not gate-isolated embedded quantum dots)

Subjects

Nanoscale science and low-D systems

Condensed matter: structural, mechanical & thermal

Dates

Issue 17 (30 April 2008)

Received 15 January 2008, in final form 27 February 2008

Published 25 March 2008



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