Akinori Saeki et al 2008 Nanotechnology 19 015705 doi:10.1088/0957-4484/19/01/015705
Akinori Saeki1,3, Takahiro Kozawa1, Seiichi Tagawa1,3, Heidi B Cao2, Hai Deng2 and Michael J Leeson2
Show affiliationsLine edge roughness (LER) of patterned features in chemically amplified (CA) resists is formed in the acid generation stage and expected to be moderated by the acid diffusion and development process. It is essential to obtain information on the limit of LER in order to realize next-generation lithographies such as electron beam or extreme ultraviolet. Here, we report for the first time a process simulator based on physical and chemical reaction mechanisms. The LER of a positive-tone CA resist after development is investigated by Monte Carlo simulation and Mack's dissolution model. We found that the LER (high frequency) of less than 1.2 nm is achievable, although the process conditions and material design for achieving such a small LER are strict.
Issue 1 (9 January 2008)
Received 9 May 2007, in final form 16 October 2007
Published 29 November 2007
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