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Molecular dynamics simulation for nanoscale deep indentation of a copper substrate by single-walled carbon nanotube tips

Jin-Yuan Hsieh1,2, Lin S Huang3,4, Chuan Chen5,6, Hsu-Cheng Lo5 and Chi-Chuan Hwang5

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Deep nanoindentation of a copper substrate by single-walled carbon nanotubes (SWCNTs) has been analyzed using molecular dynamics simulations. Three categories of SWCNTs and their relationship with temperature and nanotube length have been extensively investigated. The results of this comprehensive quantitative analysis for deep indentation demonstrate that only SWCNTs with relatively short lengths can indent into a substrate up to a desired depth without buckling. Most notably, a permanent hollow hole with a high aspect ratio will be produced on the copper substrate, while copper atoms in close proximity to the hole are only slightly disordered.


PACS

68.35.Gy Mechanical properties; surface strains

81.40.Np Fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure

62.25.-g Mechanical properties of nanoscale systems

62.20.Qp Friction, tribology, and hardness

61.46.Fg Nanotubes

62.20.M- Structural failure of materials

Subjects

Surfaces, interfaces and thin films

Nanoscale science and low-D systems

Condensed matter: structural, mechanical & thermal

Dates

Issue 41 (17 October 2007)

Received 23 July 2007, in final form 15 August 2007

Published 12 September 2007



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