Sebastian Strobel et al 2007 Nanotechnology 18 295201 doi:10.1088/0957-4484/18/29/295201
Sebastian Strobel1, Kenji Arinaga1,2, Allan Hansen1,3 and Marc Tornow1,3,4
Show affiliationsA novel concept for metal electrodes with few 10 nm separation for electrical conductance measurements in an aqueous electrolyte environment is presented. Silicon-on-insulator (SOI) material with 10 nm buried silicon dioxide serves as a base substrate for the formation of SOI plateau structures which, after recess-etching the thin oxide layer, thermal oxidation and subsequent metal thin film evaporation, feature vertically oriented nanogap electrodes at their exposed sidewalls. During fabrication only standard silicon process technology without any high-resolution nanolithographic techniques is employed. The vertical concept allows an array-like parallel processing of many individual devices on the same substrate chip. As analysed by cross-sectional TEM analysis the devices exhibit a well-defined material layer architecture, determined by the chosen material thicknesses and process parameters. To investigate the device in aqueous solution, we passivated the sample surface by a polymer layer, leaving a micrometre-size fluid access window to the nanogap region only. First current–voltage characteristics of a 65 nm gap device measured in 60 mM buffer solution reveal excellent electrical isolation behaviour which suggests applications in the field of biomolecular electronics in a natural environment.
85.35.-p Nanoelectronic devices
73.40.Qv Metal-insulator-semiconductor structures (including semiconductor-to-insulator)
Issue 29 (25 July 2007)
Received 5 April 2007, in final form 16 May 2007
Published 20 June 2007
Sebastian Strobel et al 2007 Nanotechnology 18 295201
Constantinos Skordis 2009 Class. Quantum Grav. 26 143001
T Yamanaka et al 2009 J. Phys.: Conf. Ser. 190 012149
M I Bichurin et al 2009 J. Phys. D: Appl. Phys. 42 215001
Dmitry S Koktysh et al 2007 Nanotechnology 18 495607
Lubna R Shah et al 2009 J. Phys.: Condens. Matter 21 486004
F Bardelli et al 2009 J. Phys.: Conf. Ser. 190 012192
Michalowicz Alain et al 2009 J. Phys.: Conf. Ser. 190 012034
Wei Huang and Zhaohui Wei 2009 J. Phys. A: Math. Theor. 42 295301
N J Mason 2009 J. Phys. D: Appl. Phys. 42 194003