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Scaling of ion implanted Si:P single electron devices

C C Escott1, F E Hudson1, V C Chan1, K D Petersson1,2, R G Clark3 and A S Dzurak1

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We present a modelling study on the scaling prospects for phosphorus in silicon (Si:P) single electron devices using readily available commercial and free-to-use software. The devices comprise phosphorus ion implanted, metallically doped (n+) dots (size range 50–500 nm) with source and drain reservoirs. Modelling results are compared to measurements on fabricated devices and discussed in the context of scaling down to few-electron structures. Given current fabrication constraints, we find that devices with 70–75 donors per dot should be realizable. We comment on methods for further reducing this number.


PACS

85.35.Gv Single electron devices

Subjects

Electronics and devices

Nanoscale science and low-D systems

Dates

Issue 23 (13 June 2007)

Received 16 February 2007, in final form 30 March 2007

Published 8 May 2007



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