Mingtao Li et al 2003 Nanotechnology 14 33 doi:10.1088/0957-4484/14/1/308
Mingtao Li1, Lei Chen2, Wei Zhang2 and Stephen Y Chou1
Show affiliationsWe studied the pattern transfer fidelity of nanoimprint lithography (NIL) by patterning sub-micron MESFET gates on six-inch wafers. The critical dimensions (CD) of the gate patterns on the mould, imprinted in resist, as well as after oxygen reactive ion etching (RIE) and metal lift-off were measured, separately, using an ultrahigh-resolution scanning electron microscope. Comparison of the measurements reveals that the as-imprinted gates in resist are 5.2% (or 37 nm) on average larger than those on the mould with a standard deviation of 1.2% (or 8 nm), and the gates after oxygen RIE and metal lift-off are 42% (or 296 nm) on average larger than those on the mould with a standard deviation of 8% (or 30 nm). Compared with photolithography, NIL has better pattern transfer fidelity with CD controls about four times smaller.
Issue 1 (January 2003)
Received 21 August 2002
Published 3 December 2002
Mingtao Li et al 2003 Nanotechnology 14 33
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