M S M Saifullah et al 2002 Nanotechnology 13 659 doi:10.1088/0957-4484/13/5/323
M S M Saifullah1, T Ondarçuhu2, D K Koltsov1, C Joachim2 and M E Welland1
Show affiliationsWe demonstrate a high yield production scheme to fabricate sub-5 nm co-planar metal–insulator–metal junctions. This involves determining the relationship between the actual gap between the metallic junctions for a given designed gap, and the use of weak developers with ultrasonic agitation to process the exposed resist. This results in an improved process to achieve narrow inter-electrode gaps. The gaps were imaged using an AFM equipped with a carbon nanotube tip to achieve a high degree of accuracy in measurement. The smallest gap unambiguously measured was ~ 2 nm. Gaps with ≤ 5 nm spacing were produced with a very high yield of about 75% for a designed inter-electrode distance of 0 nm. The leakage resistance of the gaps was found to be of the order of 1012 Ω. The entire junction structure was designed to be co-planar to better than 1 nm over 1 μ m2.
Surfaces, interfaces and thin films
Issue 5 (October 2002)
Received 12 August 2002, in final form 4 September 2002
Published 20 September 2002
M S M Saifullah et al 2002 Nanotechnology 13 659
Süleyman Ulusoy 2007 Nonlinearity 20 685
Chunsheng Du et al 2005 Nanotechnology 16 350
Karl Svozil 2006 New J. Phys. 8 39
Yimin Zhang et al 2010 Environ. Res. Lett. 5 014002
Michael E Webber 2007 Environ. Res. Lett. 2 034007
R. A. E. Fosbury et al. 2003 ApJ 596 797
Daniel M Kammen 2006 Environ. Res. Lett. 1 010201
Javier M Buldú et al 2007 New J. Phys. 9 172
D. Nesvorný and D. Vokrouhlický 2006 The Astronomical Journal 132 1950