Yong-Gyoo Kim et al 2004 Meas. Sci. Technol. 15 1266 doi:10.1088/0957-0233/15/7/006
Yong-Gyoo Kim1, Kee Hoon Kang1, Kee Sool Gam1, Jae-Cheon Kim2 and Ju-Hwang Kim2
Show affiliationsIn order to identify materials suitable as a compensating wire pair for the Pt/Pd thermocouple, binary Cu100−xNix (x = 3, 5, 8 and 10 wt%) alloys were prepared and their Seebeck coefficients were measured using the temperature gradient method from room temperature to approximately 120 °C using a pure platinum reference material. The Cu–Ni alloys showed negative Seebeck coefficients at all test temperatures. As the temperature increased, the Seebeck coefficients of the Cu–Ni alloys became more negative. At a fixed temperature, the Seebeck coefficients became more negative as the Ni content increased. Among the test alloys, Cu95Ni5 and Cu90Ni10 (designated as CuNi5/10) both showed a calculated thermal emf value that was very similar to that of the Pt/Pd thermocouple. It was concluded that the CuNi5/10 system could be a good compensating material for the Pt/Pd thermocouple, and by a small adjustment of the Ni content the temperature error could be reduced even further.
Issue 7 (July 2004)
Received 29 December 2003, in final form 6 April 2004
Published 7 June 2004
Yong-Gyoo Kim et al 2004 Meas. Sci. Technol. 15 1266
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