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Separately contacted monocrystalline silicon double-layer structure with an amorphous silicon dioxide barrier made by wafer bonding

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Published 3 November 2010 2010 IOP Publishing Ltd
, , Citation K Takashina et al 2010 Semicond. Sci. Technol. 25 125001 DOI 10.1088/0268-1242/25/12/125001

0268-1242/25/12/125001

Abstract

A double layer of monocrystalline silicon separated by a 23.5 nm silicon dioxide barrier is fabricated by bonding two silicon-on-insulator wafers with oxidized surface layers. The two layers are separately contacted allowing transport measurements through individual layers and a bias voltage to be applied between the layers. Four-terminal magnetotransport measurements at cryogenic temperatures on electrons generated close to the central oxide barrier show reasonable mobility.

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10.1088/0268-1242/25/12/125001