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Investigation of the injection velocity of holes in strained Si pMOSFETs

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G Nicholas1, T J Grasby1, E H C Parker1, T E Whall1, D J Paul2, A G R Evans3 and H von Känel4

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LETTER TO THE EDITOR

Using a pulsed measurement system, the drain current in a high mobility strained Si pMOSFET was extracted in the absence of self-heating. This was used to demonstrate that the injection velocity of holes from the source is well below the thermal limit for biaxial tensile strained Si pMOSFETs down to 0.1 µm channel length.


PACS

85.30.Tv Field effect devices

85.30.De Semiconductor-device characterization, design, and modeling

Subjects

Electronics and devices

Semiconductors

Dates

Issue 5 (May 2005)

Received 30 November 2004, in final form 15 February 2005

Published 4 March 2005



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