P D Scovell et al 1989 Rep. Prog. Phys. 52 349 doi:10.1088/0034-4885/52/3/003
P D Scovell, C N Duckworth and P J Rosser
Show affiliationsThe manufacture of complex integrated circuits demanded by present-day system designers requires the assembly of a large number of interacting process steps. Many of these process steps cannot be chosen without considering the effect of the other steps involved in the manufacturing process. A great deal of understanding of the basic physical principles must be employed before a successful manufacturing process can be defined. The optimisation of the steps and their timely introduction to enable the device to enter the marketplace dictates that an efficient means of predicting the impact of a particular recipe must be employed. This review surveys the various physical principles that underly the processing steps, highlights some of the anomalous behaviour that occurs and describes the tools currently available to help the process physicist design diffusion, oxidation, ion implantation, deposition and photo-lithographic routines. An example of the use of these tools, and an indication of forthcoming developments, will be given.
85.40.Bh Computer-aided design of microcircuits; layout and modeling
85.40.Ry Impurity doping, diffusion and ion implantation technology
85.40.Hp Lithography, masks and pattern transfer
61.72.J- Point defects and defect clusters
85.30.De Semiconductor-device characterization, design, and modeling
Issue 3 (March 1989)
P D Scovell et al 1989 Rep. Prog. Phys. 52 349
G Stoltz 2005 Nonlinearity 18 1967
F H J Cornish and B Micklewright 1996 Class. Quantum Grav. 13 2505
Chunchieh Huang et al 2002 J. Micromech. Microeng. 12 767
G Heinzel et al 2006 Class. Quantum Grav. 23 S119
Danick Briand et al 2005 J. Micromech. Microeng. 15 1657
C. Deibel et al 2004 Europhys. Lett. 66 399
Neil J Cornish 2002 Class. Quantum Grav. 19 1279
M A Jilany 2003 J. Phys. G: Nucl. Part. Phys. 29 2263
P Glynne-Jones et al 2000 Meas. Sci. Technol. 11 526